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首页 > Products > Aluminum Based Copper Clad Lamiante Sheet for PCB (AL CCL)
Aluminum Based Copper Clad Lamiante Sheet for PCB (AL CCL)
单价 $1.10 / sheet对比
询价 暂无
浏览 286
发货 Chinahainanhaikou
库存 10000000000sheet
过期 长期有效
更新 2020-08-08 10:27
 
详细信息
Product Name: Aluminum based Copper Clad Lamiante Sheet for PCB (AL CCL) Brand: Hjh Insulation Materials: metal Composite Materials base Material: Aluminum Production Process: Laminateing Processing Technology: Delay Pressure Foil Flame Retardant Properties: V0 Application: Consumer Electronics Material: Aluminum/Copper Foil Dielectric: Aluminum Structure: Single-Sided Rigid PCB Trademark: HJH Transport Package: Pallet Specification: Metri ton Origin: China HS Code: 7410211000 Product Description 1.FEATURES--Mechanical strength and dimensional stability--Excellentheating radiating-- Electric magnetic shield--Easy machinery cutting2.APPLICATIonused in the fields of audio and power equipments, telecommunication, power LED, automobile, computer, power module, etc. 3.TECHNICAL DATA SHEETItemsUnitTest conditionTypical valuesAF-01AF-04AF-05Peel strengthN/mmAt normal: A2.001.051.08After thermal stress1.801.051.05Surface resistanceMΩAt normal5.0 x 1075.0 x 1073.6 x 107Constant humidity treatment2.0 x 1064.5 x 1063.3 x 106Volume resistanceMΩ·mAt normal4.0 x 1081.0 x 1084.2 x 108Constant humidity treatment5.0 x 1071.9 x 1073.1 x 107Thermal resistanceºC/wAt normal1.00.650.45Dielectric Constant @ 1 MHz--40ºC, 93%, 96h4.24.24.2Dielectric dissipation factor @1 MHz -- 40ºC, 93%, 96h0.020.0290.033Thermal stressmin260ºC2 min, no delamination, no air bulbDielectric breakdownKV/MMAt normal313160Flammability--At normalFV-0Thermal-conductive factor W/m·k At normal1.01.52.2